China Rigid Flexible Rigid-flex Printed Circuit Boards PCB Manufacturer
Material: Polymide/PI, coverlay
Board thickness: 1.6mm
Surface treatment: Immersion Gold, ENIG, Immersion silver/Sn, HASL, LF-HASL
Technology: Microvia Manufacturing, patterning and copper plating control, product reliability test technology
Payment: L/C,T/T,Western Union,paypal
Certification: ULConsumer(Wear,ElectronicDigital,HouseholdAppliances,Connectors)/IndustrialControl/AutomobileTS16949/Medical/Server,CloudComputing&BaseStation/Aviation/Military/Communication(CertificationinRelatedApplications)
Delivery Term: DDU, FOB, CFA, CIF, CPT, EXW
Background
SCHWEIZER's rigid multilayer PCBs can contain plated and non-plated through hole and blind & buried vias. Multilayer PCBs are produced with FR4 or higher quality base materials. As standard, a maximum of 18 layers are used and PCB thicknesses in the range of 0.6 mm to 3.2 mm are realised.

GigaDevice's Parallel NAND Flash complies with ONFI 1.0 protocol. The product provides 1Gb to 8Gb density options. It supports either 3V or 1.8V voltage, and x8 or x16 I/O interfaces, as well as mainstream packages such as TSOP48 and BGA63. GigaDevice Parallel NAND Flash is a showcase based on the company’s proven design philosophy and its commitment to independent design ability. The incorporation of innovative breakthroughs and rigorous quality control standards throughout the product’s design provides industrial, communication, and consumer electronic applications with a wide range of high-speed and high-reliability solutions.





Items
• Circuit Constructions
• Material
• Copper weights
• Layer Count
• Stack up
• Surface finish
• Vias
• Advanced tech
• 1+n+1
Capability
• Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex
• FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc
• 0.5oz~10oz
• 1-64 layers
• Control Dielectric/Control Impedance/TDR Testing
• Lead-Free/HASL/ENIG/ENEPIG/Hard Gold/Wire Bonded Gold/Immersion Silver/OSP/selective osp
• Blind-buried/via-in-pad/POFV/Filled-vias/epoxy resin filled vias
• Embedded /Laser drill/Multi-level cavity/Build-up HDI/Long-short staged gold finger/Hybrid/metal-core/press-fit
• 0.8:1(Depth included copper thickness)
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